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Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer

Crossref DOI link: https://doi.org/10.1007/s11664-014-3430-9

Published Online: 2014-10-09

Published Print: 2014-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chuang, T. H.

Lin, H. J.

Chuang, C. H.

Yeh, W. T.

Hwang, J. D.

Chu, H. S.
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