Effects of Cu, Zn on the Wettability and Shear Mechanical Properties of Sn-Bi-Based Lead-Free Solders
Crossref DOI link: https://doi.org/10.1007/s11664-014-3460-3
Published Online: 2014-11-01
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shen, Jun
Pu, Yayun
Yin, Henggang
Tang, Qin
Text and Data Mining valid from 2014-11-01