Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages
Crossref DOI link: https://doi.org/10.1007/s11664-014-3572-9
Published Online: 2015-01-09
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhou, Bite
Zhou, Quan
Bieler, Thomas R.
Lee, Tae-kyu
Text and Data Mining valid from 2015-01-09