Polyimide-Damage-Free, CMOS-Compatible Removal of Polymer Residues from Deep Reactive Ion Etching Passivation
Crossref DOI link: https://doi.org/10.1007/s11664-014-3604-5
Published Online: 2015-01-08
Published Print: 2015-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, W.J.
Zhu, T.
Liu, J.Q.
Fan, J.
Tu, L.C.
Text and Data Mining valid from 2015-01-08