Hygro-thermo-mechanical Behavior of Adhesive-Based Flexible Chip-on-Flex Packaging
Crossref DOI link: https://doi.org/10.1007/s11664-015-3627-6
Published Online: 2015-01-23
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Cheng, Hsien-Chie
Huang, Ho-Hsiang
Chen, Wen-Hwa
Lu, Su-Tsai
Text and Data Mining valid from 2015-01-23