Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material
Crossref DOI link: https://doi.org/10.1007/s11664-015-3642-7
Published Online: 2015-01-30
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Li, Siyang
Yang, Donghua
Tan, Qing
Li, Liangliang
Text and Data Mining valid from 2015-01-30