Micro-Power Generation Characteristics of Thermoelectric Thin Film Devices Processed by Electrodeposition and Flip-Chip Bonding
Crossref DOI link: https://doi.org/10.1007/s11664-015-3647-2
Published Online: 2015-02-05
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shin, Kang-Je
Oh, Tae-Sung
Text and Data Mining valid from 2015-02-05
