Fumed-Alumina-Derived Nanoporous Alumina as a New Low-k Dielectric Material for Microelectronics Packaging
Crossref DOI link: https://doi.org/10.1007/s11664-015-3667-y
Published Online: 2015-02-26
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Takizawa, Yoshihiro
Chung, D. D. L.
Text and Data Mining valid from 2015-02-26