Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process
Crossref DOI link: https://doi.org/10.1007/s11664-015-3718-4
Published Online: 2015-03-26
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Seung-Woo
Lee, Tae-Hyung
Park, Ji-Won
Kim, Hyun-Joong
Text and Data Mining valid from 2015-03-26