Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications
Crossref DOI link: https://doi.org/10.1007/s11664-015-3752-2
Published Online: 2015-04-17
Published Print: 2015-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mu, Wei
Sun, Shuangxi
Jiang, Di
Fu, Yifeng
Edwards, Michael
Zhang, Yong
Jeppson, Kjell
Liu, Johan
Text and Data Mining valid from 2015-04-17