Creep Behavior of 95.8Sn–3.5Ag–0.7Cu Solder Joints, and a Modified Constitutive Model for the Joints
Crossref DOI link: https://doi.org/10.1007/s11664-015-3773-x
Published Online: 2015-04-21
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Tang, Y.
Li, G. Y.
Luo, S. M.
Wang, K. Q.
Zhou, B.
Text and Data Mining valid from 2015-04-21
