Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate
Crossref DOI link: https://doi.org/10.1007/s11664-015-3774-9
Published Online: 2015-04-18
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, Yang
Sun, Fenglian
Luo, Liangliang
Yuan, Cadmus A.
Zhang, Guoqi
Text and Data Mining valid from 2015-04-18