An Investigation into the Package and Printed Circuit Board Assembly Solutions of an Ultrathin Coreless Flip-Chip Substrate
Crossref DOI link: https://doi.org/10.1007/s11664-015-3794-5
Published Online: 2015-06-18
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chang, Jing-Yao
Chaung, Tung-Han
Chang, Tao-Chih
Text and Data Mining valid from 2015-06-18