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Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention

Crossref DOI link: https://doi.org/10.1007/s11664-015-3798-1

Published Online: 2015-05-05

Published Print: 2015-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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