New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic Substrate
Crossref DOI link: https://doi.org/10.1007/s11664-015-3817-2
Published Online: 2015-05-20
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jang, J. W.
Yoo, S. J.
Hwang, H. I.
Yuk, S. Y.
Kim, C. K.
Kim, S. J.
Han, J. S.
An, S. H.
Text and Data Mining valid from 2015-05-20