Enhancing Chemical Stability of Electroplated Cu Films by Engineering Electrolyte Chemistry and Twinning Structure
Crossref DOI link: https://doi.org/10.1007/s11664-015-3839-9
Published Online: 2015-05-19
Published Print: 2015-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Chih-Jie
Huang, Chun-Lung
Liao, Chien-Neng
Text and Data Mining valid from 2015-05-19
