Microstructure and Mechanical Properties of Tin-Bismuth Solder Reinforced by Aluminum Borate Whiskers
Crossref DOI link: https://doi.org/10.1007/s11664-015-3896-0
Published Online: 2015-07-03
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Jun
Wei, Hongmei
He, Peng
Lin, Tiesong
Lu, Fengjiao
Funding for this research was provided by:
National Natural Science Foundation of China (51275135, 51474081, 51475103, 51321061)
Text and Data Mining valid from 2015-07-03