Crossmark

Microstructure and Grain Orientation Evolution in Sn-3.0Ag-0.5Cu Solder Interconnects Under Electrical Current Stressing

Crossref DOI link: https://doi.org/10.1007/s11664-015-3922-2

Published Online: 2015-07-07

Published Print: 2015-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chen, Hongtao

Hang, Chunjin

Fu, Xing

Li, Mingyu
Funding

Funding for this research was provided by:

National Natural Science Foundation (51375116)

Shenzhen Special Funds for Overseas High-level Talents (KQC201109020053A)

Shenzhen Special Funds for Strategic Emerging Industries (JCYJ20140417172417135)

Funds for Supporting National and Provincial Plans (GJHS20120627112429510)
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