Particle Arrangement Design for Predicting the Percolation Threshold of Silver/Epoxy Composite for Electrically Conductive Adhesive Application
Crossref DOI link: https://doi.org/10.1007/s11664-015-3923-1
Published Online: 2015-07-30
Published Print: 2015-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zulkarnain, M. https://orcid.org/0000-0001-7942-5498
Husaini, Muhammad
Mariatti, M.
Azid, I. A.
Text and Data Mining valid from 2015-07-30
