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Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits

Crossref DOI link: https://doi.org/10.1007/s11664-015-3925-z

Published Online: 2015-07-14

Published Print: 2015-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Hsu, H. H.

Huang, Y. T.

Huang, S. Y.

Chang, T. C.

Wu, Albert T.
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