Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation
Crossref DOI link: https://doi.org/10.1007/s11664-015-3929-8
Published Online: 2015-07-21
Published Print: 2015-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rautiainen, Antti
Xu, Hongbo
Österlund, Elmeri
Li, Jue
Vuorinen, Vesa
Paulasto-Kröckel, Mervi
Text and Data Mining valid from 2015-07-21