Effect of Process and Service Conditions on TLP-Bonded Components with (Ag,Ni–)Sn Interlayer Combinations
Crossref DOI link: https://doi.org/10.1007/s11664-015-3982-3
Published Online: 2015-08-28
Published Print: 2015-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lis, Adrian
Leinenbach, Christian
Text and Data Mining valid from 2015-08-28