Crossmark

Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-1.0Ag-0.5Cu–0.2BaTiO3 Composite Solder

Crossref DOI link: https://doi.org/10.1007/s11664-015-3993-0

Published Online: 2015-09-01

Published Print: 2015-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yang, Li

Ge, Jinguo https://orcid.org/0000-0002-2157-2919
Liu, Haixiang

Xu, Liufeng

Bo, Anbing
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51401037)

Science and Technology Program of Jiangsu Province of China (BK20141228)

Science and Technology Program of Suzhou (SYG201421)

Science and Technology Program of Suzhou (SYG201348)

Science and Technology Program of Suzhou (SYG201251)

Natural Science Foundation of the Jiangsu Higher Education Institutions of China (14KJB430001)

Natural Science Foundation of the Jiangsu Higher Education Institutions of China (13KJB430001)

Scientific Research Project of Changshu Institute of Technology (JXK2014003)

Jiangsu Key Laboratory of Large Engineering Equipment Detection and Control (JSKLEDC201301)
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