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A Novel Conditional Probability Density Distribution Surface for the Analysis of the Drop Life of Solder Joints Under Board Level Drop Impact

Crossref DOI link: https://doi.org/10.1007/s11664-015-4012-1

Published Online: 2015-10-16

Published Print: 2016-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Gu, Jian

Lei, YongPing

Lin, Jian

Fu, HanGuang

Wu, Zhongwei
Funding

Funding for this research was provided by:

The National Natural Science Foundation of China (CN) (51275006, 51005004)

Beijing Municipal Natural Science Foundation (KZ201110005002, 3132006)
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Text and Data Mining valid from 2015-10-16