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Recent Progress in Ohmic Contacts to Silicon Carbide for High-Temperature Applications

Crossref DOI link: https://doi.org/10.1007/s11664-015-4107-8

Published Online: 2015-11-03

Published Print: 2016-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Wang, Zhongtao

Liu, Wei

Wang, Chunqing
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51374084)

Power Electronics Science and Education Development Program of Delta Environmental & Educational Foundation
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Text and Data Mining valid from 2015-11-03