Crossmark

Interfacial Reactions of Low-Melting Sn-Bi-Ga Solder Alloy on Cu Substrate

Crossref DOI link: https://doi.org/10.1007/s11664-015-4142-5

Published Online: 2015-10-28

Published Print: 2016-01

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chen, Chih-Hao

Lee, Boon-Ho

Chen, Hsiang-Chua

Wang, Chang-Meng

Wu, Albert T.
Funding

Funding for this research was provided by:

Ministry of Science and Technology, Taiwan (NSC 101-2221-E-008-026-MY3)

SHENMAO Technology Inc., Taiwan
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