Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects
Crossref DOI link: https://doi.org/10.1007/s11664-015-4186-6
Published Online: 2015-11-20
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Tae-Kyu
Bieler, Thomas R.
Kim, Choong-Un
Text and Data Mining valid from 2015-11-20
