Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates
Crossref DOI link: https://doi.org/10.1007/s11664-015-4204-8
Published Online: 2015-11-25
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Meinshausen, L.
Bhassyvasantha, S.
Majumdar, B. S.
Dutta, I.
Funding for this research was provided by:
National Science Foundation (CMMI-1335199/1335491)
Text and Data Mining valid from 2015-11-25
Version of Record valid from 2015-11-25
Article History
Received: 18 May 2015
Accepted: 31 October 2015
First Online: 25 November 2015