Advantages and Challenges of 10-Gbps Transmission on High-Density Interconnect Boards
Crossref DOI link: https://doi.org/10.1007/s11664-016-4423-7
Published Online: 2016-03-09
Published Print: 2016-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yee, Chang Fei https://orcid.org/0000-0001-6766-0845
Jambek, Asral Bahari
Al-Hadi, Azremi Abdullah
Text and Data Mining valid from 2016-03-09
