Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints
Crossref DOI link: https://doi.org/10.1007/s11664-016-4471-z
Published Online: 2016-04-06
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Mukherjee, S.
Chauhan, P.
Osterman, M.
Dasgupta, A.
Pecht, M.
Text and Data Mining valid from 2016-04-06