Crossmark

Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints

Crossref DOI link: https://doi.org/10.1007/s11664-016-4509-2

Published Online: 2016-04-13

Published Print: 2016-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yang, Li

Ge, Jinguo

Zhang, Yaocheng

Dai, Jun

Liu, Haixiang

Xiang, Jicen
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51401037)

Science and Technology Program of Jiangsu Province of China (BK20141228)

Science and Technology Program of Suzhou (SYG201421, SYG201348, SYG201251)

Natural Science Foundation of the Jiangsu Higher Education Institutions of China (14KJB430001, 13KJB430001)

Scientific Research Project of Changshu Institute of Technology (JXK2014003)

Jiangsu Key Laboratory of Large Engineering Equipment Detection and Control (JSKLEDC201301)
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