Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test
Crossref DOI link: https://doi.org/10.1007/s11664-016-4517-2
Published Online: 2016-04-19
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Myung, Woo-Ram
Kim, Yongil
Kim, Kyung-Yeol
Jung, Seung-Boo
Text and Data Mining valid from 2016-04-19