Miniaturization of Micro-Solder Bumps and Effect of IMC on Stress Distribution
Crossref DOI link: https://doi.org/10.1007/s11664-016-4541-2
Published Online: 2016-04-28
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Choudhury, Soud Farhan
Ladani, Leila
Funding for this research was provided by:
National Science Foundation (1416682)
Text and Data Mining valid from 2016-04-28
Version of Record valid from 2016-04-28
Article History
Received: 8 September 2015
Accepted: 12 April 2016
First Online: 28 April 2016