Sn-Ag-Cu Nanosolders: Solder Joints Integrity and Strength
Crossref DOI link: https://doi.org/10.1007/s11664-016-4584-4
Published Online: 2016-05-13
Published Print: 2016-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Roshanghias, Ali
Khatibi, Golta
Yakymovych, Andriy
Bernardi, Johannes
Ipser, Herbert
Funding for this research was provided by:
Austrian Science Fund (P26304)
License valid from 2016-05-13