Crossmark

Solid Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode

Crossref DOI link: https://doi.org/10.1007/s11664-016-4645-8

Published Online: 2016-06-02

Published Print: 2016-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Lin, Y. C.

Lee, K. T.

Hwang, J. D.

Chu, H. S.

Hsu, C. C.

Chen, S. C.

Chuang, T. H.
Funding

Funding for this research was provided by:

Ministry of Science and Technology (NSC 102-2221-E-002-057-MY3)

Industrial Technology Research Institute (104-S-A28)
License Information

License valid from 2016-06-02