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Preparation and Sintering Properties of Ag27Cu2Sn Nanopaste as Die Attach Material

Crossref DOI link: https://doi.org/10.1007/s11664-016-4664-5

Published Online: 2016-06-07

Published Print: 2016-10

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Liu, Xiaojian

Liu, Wei

Wang, Chunqing

Zheng, Zhen

Kong, Lingchao
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51374084)

Power Electronics Science and Education Development Program of Delta Environmental & Educational Foundation
License Information

License valid from 2016-06-07