Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing
Crossref DOI link: https://doi.org/10.1007/s11664-016-4708-x
Published Online: 2016-06-15
Published Print: 2016-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lai, Kuei-Chang
Wu, Pei-Yu
Chen, Chih-Ming
Wei, Tzu-Chien
Wu, Chung-Han
Feng, Shien-Ping
Funding for this research was provided by:
the Ministry of Science and Technology, Taiwan (MOST 103-2622-E-007-008-CC2)
License valid from 2016-06-15