Adhesion, Modulus and Thermal Conductivity of Porous Epoxy Film on Silicon Wafers
Crossref DOI link: https://doi.org/10.1007/s11664-016-4793-x
Published Online: 2016-07-28
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jagannadham, K. http://orcid.org/0000-0003-2954-7387
License valid from 2016-07-28