Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics
Crossref DOI link: https://doi.org/10.1007/s11664-016-4837-2
Published Online: 2016-08-15
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hong, Won Sik
Oh, Chulmin
Kim, Mi-Song
Lee, Young Woo
Kim, Hui Joong
Hong, Sung Jae
Moon, Jeong Tak
License valid from 2016-08-15