In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits
Crossref DOI link: https://doi.org/10.1007/s11664-016-4874-x
Published Online: 2016-09-08
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Huang, Y. T.
Chen, C. H.
Lee, B. H.
Chen, H. C.
Wang, C. M.
Wu, Albert T.
Funding for this research was provided by:
Ministry of Science and Technology of the People’s Republic of China (No. 101-221-E-008-026-MY3)
License valid from 2016-09-08