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Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Crossref DOI link: https://doi.org/10.1007/s11664-016-4902-x

Published Online: 2016-09-06

Published Print: 2016-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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