Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates
Crossref DOI link: https://doi.org/10.1007/s11664-016-4941-3
Published Online: 2016-10-21
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Liu, C. Y.
Wei, Y. S.
Lin, E. J.
Hsu, Y. C.
Tang, Y. K.
License valid from 2016-10-21