Crossmark

Electrochemical Migration of Fine-Pitch Nanopaste Ag Interconnects

Crossref DOI link: https://doi.org/10.1007/s11664-016-5000-9

Published Online: 2016-10-24

Published Print: 2016-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Tsou, Chia-Hung

Liu, Kai-Ning

Lin, Heng-Tien

Ouyang, Fan-Yi
Funding

Funding for this research was provided by:

NTHU / ITRI Joint Research Center, Taiwan (104-B-01-D101W3H000)

Ministry of Science and Technology, Taiwan (102-2221-E-007-051-MY3)
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License valid from 2016-10-24