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The Failure Models of Lead Free Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Low-G and High-G Drop Impact

Crossref DOI link: https://doi.org/10.1007/s11664-016-5027-y

Published Online: 2016-11-23

Published Print: 2017-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Gu, Jian

Lei, YongPing

Lin, Jian

Fu, HanGuang

Wu, Zhongwei
Funding

Funding for this research was provided by:

The National Natural Science Foundation of China (51275006)

The Beijing Natural Science Foundation (3132006)
License Information

License valid from 2016-11-23