The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire
Crossref DOI link: https://doi.org/10.1007/s11664-016-5044-x
Published Online: 2016-11-02
Published Print: 2016-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Huang, Wei-Hsiang https://orcid.org/0000-0002-4796-6609
Lin, Kwang-Lung
Lin, Yu-Wei
Cheng, Yun-Kai
License valid from 2016-11-02
