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Thermal Stress Assessment for Transient Liquid-Phase Bonded Si Chips in High-Power Modules Using Experimental and Numerical Methods

Crossref DOI link: https://doi.org/10.1007/s11664-016-5064-6

Published Online: 2016-11-02

Published Print: 2017-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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