Interfacial Microstructure Evolution and Shear Behavior of Au-Sn/Ni-xCu Joints at 350°C
Crossref DOI link: https://doi.org/10.1007/s11664-016-5094-0
Published Online: 2016-12-07
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Peng, J.
Wang, R. C.
Wang, M.
Liu, H. S.
License valid from 2016-12-07