Silver Adhesive Layer for Enhanced Pressure-Free Bonding Using Copper Nanoparticles
Crossref DOI link: https://doi.org/10.1007/s11664-016-5106-0
Published Online: 2016-11-11
Published Print: 2017-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Satoh, Toshikazu
Ishizaki, Toshitaka
Akedo, Kunio
License valid from 2016-11-11
