Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration
Crossref DOI link: https://doi.org/10.1007/s11664-016-5149-2
Published Online: 2016-11-29
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhao, N.
Deng, J. F.
Zhong, Y.
Huang, M. L.
Ma, H. T.
Funding for this research was provided by:
National Natural Science Foundation of China (51301030 and 51675080)
License valid from 2016-11-29