Effect of Sn Grain Orientation on Formation of Cu6Sn5 Intermetallic Compound Under Current Stressing
Crossref DOI link: https://doi.org/10.1007/s11664-016-5154-5
Published Online: 2016-12-19
Published Print: 2017-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Ming-Yao
Lin, Han-wen
Chen, Chih
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (101-2628-E-009-017-MY3)
License valid from 2016-12-19